IC design debug, FA, RA and verification
IC decapsulaiotn
     - Automatic / Equipment De-cap.
     - Manual De-cap.
     - For BGA, TCP, COF, COB, QFP, TSOP......
De-layer/de - process
     - RIE/HDP
     - SEM/EDX
Circuit repairing
     - FIB
     - Laser Cut
ESD/Latch up
     - ESD: HBM, MM, CDM
     - Test & analysis
Probe-less Diagnosis
     - Advanced Design debugging
Package analysis
     - Real-time 3D X-ray
     - SAT
IC engineering testing
Reliability test

ESD/LU (HBM, MM, CDM, System level)
HTOL(High Temperature Operating Life Test)
LTOL(Low Temperature Operating Life Test)
THB (Temperature Humidity Bias Test)
HAST(High Accelerated stress test)
TH(Temperature/ Humidity Storage Test)
HTSL(High Temperature Storage Test)
LTOL(Low Temperature Storage Test)
Pre-con(Pre-condition test)
Reflow(Lead Free Reflow profile available)
TCT(Temperature Shock Test)
TST(Thermal Shock Test)
Solder-ability