Various
kinds
of reliability
tests
and
failure
analysis
are
provided
thanks
to the
powerful
technical
resourece
and
facilities
at the
verification
center
of Spirox.
Moreover,
our
highly
reliable
service
has
been
verified
though
the
certifications
awarded
by various
quality
certification
such
as ISO9001,
QC001002,
IEC
17025,
and
so on.
IC design debug, FA, RA and verification IC decapsulaiotn
- Automatic / Equipment De-cap.
- Manual De-cap.
- For BGA, TCP, COF, COB, QFP, TSOP...... De-layer/de - process
- RIE/HDP
- SEM/EDX Circuit repairing
- FIB
- Laser Cut ESD/Latch up
- ESD: HBM, MM, CDM
- Test & analysis Probe-less Diagnosis
- Advanced Design debugging Package analysis
- Real-time 3D X-ray
- SAT IC engineering testing Reliability test
ESD/LU (HBM, MM, CDM, System level) HTOL(High Temperature Operating Life Test)
LTOL(Low Temperature Operating Life Test) THB (Temperature Humidity Bias Test) HAST(High Accelerated stress test) TH(Temperature/ Humidity Storage Test) HTSL(High Temperature Storage Test) LTOL(Low Temperature Storage Test) Pre-con(Pre-condition test) Reflow(Lead Free Reflow profile available) TCT(Temperature Shock Test) TST(Thermal Shock Test)
Solder-ability
IC design debug, FA, RA and verification
