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| SERVICE FLOW |
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| Various IC tests such as the reliability test, failure analysis, and so forth are being supported for the finished products if the fab processing and package are completed after the design in the IC manufacturer.
Moreover, it contributes to effectively developing products and enhancing customer competitiveness by supporting the competitive back-end turnkey service (TTM P.S.) through the separate program (TTM P.S.) developed in-house by Spirox to provide technological resources that may be lacking in an IC manufacturer after the IC design. |
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